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Introducing to HMI eScan™:
The most advanced
e-beam inspection tool
eScan™ is a state-of-the-art electron-beam
wafer inspection system for advanced wafer manufacturers.
eScan™ distinguishes itself from competitors
with the market leading sensitivity to electrical and physical
defects in advanced devices. With the advent of eScan™, defectivity baseline in advanced fabs is being recalibrated.
eScan™ offers the shortcut to the faster yield enhancement with the
smallest e-beam inspection pixel size, high resolution imaging
for both inspection and review, crystal clear image quality
for R&D devices, and the HMI unique self-adjusting charge
control capability.
Applications:
Unlike other EBI systems, eScan™ is capable of reference data generation for physical as well as electrical
defectivity. eScan™'s main
application includes: Contact Etch Layer, Metal CMP Layers,
L/S physical defect detection, SOI, Low K, and Cu applications.
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